Superfine 0.01mm Thin Copper insulated Jumper Wire for cell phone PCB Fingerprint Sodering Point Repair, iPhone 7 8 8P X Logic Board PCB Fingerprint Sodering Point connecting line, with Nand protection Cover and ultra-Thin blade for BGA CHIP.
0.01mm Thin Copper Insulated Jumper Wire: PCB Fingerprint Sodering Point connecting line
Option 1: 3 x jumpers wire + 10 x fingerprint cutting blade
Option 2: 3 x jumpers wire + 10 x fingerprint cutting blade+9 x Nand protection Cover
0.01mm Jumper Wire
0.01MM PCB Jumpers Wire is ultra-fine insulated jumper Wire, The kit also include iPhone Nand protection Cover and PCB repair Fingerprint cutting blade imported from Germany,
The jumper wire kit is compatible with iPhone 8 8P 8X, which will offer great performance for fingerprint repair and welding disconnection on iPhone CPU BASEBAND components.
Jumpers Wire: thinner than 0.02 mm, thinner than the wiring on A10 cover Cutting Knife: Custom imported Germany blade
NAND Protection Cover: help new hand to insert NAND in a safer way for avoiding CPU damage (especially for iphone 6s cover)
Note: add some solder flux / paste between motheboard and cover, which can increase thermal conductivity and reduce CPU heating