Medium Temperature 183℃ Sn62.8/Pb36.8/Ag0.4 Lead Solder Paste 55g, Phone motherboard BGA Chip Soldering Tin Cream, melting point 183℃ Medium Temperature Phone PCB BGA Solder Flux Paste, High quality medium temperature tin paste Melting point is about 183℃
Medium Temperature 183℃ Sn62.8/Pb36.8/Ag0.4 Lead Solder Paste
Medium temperature Solder paste with lead, melting point is 183℃, Sn62.8/Pb36.8/Ag0.4, 55g or 42g
Two types of packaging:
1: Syringe packaging: Needle tube
FIX-229 Sn62.8/Pb8/Ag0.4 42g
2: Canned packaging:
FIX-228 Sn62.8/Pb36.8/Ag0.4 55g
Shining solder joints
Full solder joint
Good tin drop performance
1. With strong continuous printing performance, it is suitable for fine pitch IC, BGA and relatively nice component soldering.
2. Wettability and demould properties are good, anti-cold & hot collapse and anti-dry are strong.
3. Applicable to a variety of high-demand materials PCB welding, nice pitch and high-precision components and few tin-connection tombstoning displacement phenomenon.
4. Full tin and shinning tin beads, less residue, white and transparent, and there is no strong corrosive substance such as fluorine.