PHONEFIX Lead-Free Solder Paste for phone repair BGA soldering and Solder Paste BGA Stenciling, high, medium and low temperature Lead-Free Solder Paste for cell phone circuit board repair like BGA welding or BGA Stenciling. This high quality solder paste can be available for different temperature to allow more precison cell phone PCB BGA soldering repair: high temperature is 260 °C, medium temperature is 183°C, low temperature is 138°C,
Out Of Stock. Replacement: FIX384
Low Medium High Temperature Lead-free BGA solder paste phone repair
Option 1: high temperature: 260 ℃- 32.6g
Option 2: medium temperature: 183℃ Sn62.8/Pb36.8/Ag0.4 - 50.0g
Option 3: low temperature: 138℃ Sn42/Bi68 Lead-Free -- 50.0g.
LANRUI Low Temperature Lead Free Solder Paste, No-clean, Less residual, Shinning and full welding spot, lead-free and low temperature, High Conductivity LANRUI Solder Paste with Lead and Silver No-clean, Less residual, Shinning and full welding spot, optional midium and low temperature
Low Temperature 138℃ Sn42/Bi68 and Medium Temperature 183℃ Sn62.8/Pb36.8/Ag0.4 Solder Paste for mobile phone PCB repair,
Less residual, high insulation resistance
high performance, clean free, no solder bead, easy to dry
Origin: Shenzhen, China
Warranty: 1 year
Melting point: Low Temperature 138℃ and Medium Temperature 183℃
Main purpose: PCB Pad Welding
Material: Lead Free / Lead
Storage environment: room temperature / cold storage
1. With strong continuous printing performance, it is suitable for fine pitch IC, BGA and relatively nice component soldering.
2. Wettability and demould properties are good, anti-cold&hot collapse and anti-dry are strong.
3. Applicable to a variety of high-demand materials PCB welding, nice pitch and high-precision components and few tin-connection tombstoning displacement phenomenon.
4. Full tin and shinning tin beads, less residue, white and transparent, and there is no strong corrosive substance such as fluorine.
260 ℃ high Temperature 32.6g