High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream. Applicable to PCB, BGA, SMD, PGA repair repair, Soldering Repair cream Solder Paste Welding Fluxes for Soldering Station Tin Cream Welding Seal Grease Tools.
MECHANIC BGA Solder Paste Tin Rosin-Based Flux Paste Cream
[ Option Model: ]:
Option 1: MCN-UV50
Option 2: MCN-UV80
Packing: aluminum box
Applicable to PCB, BGA, SMD, PGA repair repair
1. Wipe the surface of the object before soldering.
2. Apply the paste flux to the solder joint.
3. Solder the tin to the solder joint with soldering iron.
MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair. Electric Soldering Iron Welding Fluxes for phone circuit board repair
High bond strength. PH value neutral, insulation is strong, welding surface smooth
IC and PCB for no corrosive
Its boiling point only slightly higher than the melting point of the solder
For mobile phones, PC cards and other sophisticated electronic chip-level help welding