MECHANIC High Synthetic Soldering Tin Paste XG-Z40 / XG-50 for Phone Chip Reballing Sn63/Pb37 25-45um 10CC BGA PCB BGA Repair Tool
- Advanced insulation technology, a high viscosity no-clean flux, it can be used for PCB, SMD reworking, as well as reballing of computer and phone chips.
- The mixture of high-quality alloyed powder and resinic pasty flux, which avoid the pale yellow residue, so you are easy to clean the board.
- Super compacity: Soldering paste for cell phone PCB, SMD, PGA and computer etc.
- Help to repair the circuit boards and protect the electronic components
- Flux Solder Paste - no clean soldering
- Syringe solder paste is an ideal assistant for phone motherboard and repairing cell phone surface mount assemblies.
- High quality, perfect performance, easy to weld.
- Suitable for mobile phone repair industry, computer digital service industry, high-precision circuit board SMD welding, BGA welding technology and so on.
- Material: Tin+Solder Past
- Type: BGA Soldering Tin Cream
- Product: XG-Z40
- Volume: 10CC
- Alloy: Sn63/Pb37
- Design: Squeeze tube needle dispense
- Microns: 20-38u
- Application: Applicable to Phone PCB, BGA, SMD, PGA Repair
- Usage: PCB BGA Repairing Tool
- Function: Repair the Circuit Boards, Protect The Electronic Components
- Is-customized: No