MJ FC03 3 IN 1 Pre-Heating Station CH3 Desoldering Platform, iPhone X/XS/XSMAX Motherboard Layred Welding Platform For iPhone CPU chip HHD Baseband Glue Removal.
MJ CH3 Motherboard Layered Soldering Platform for iPhone X Xs Max PCB Teardown
3 in 1 Pre-Heating Station support iphone A11 A12 CPU chip, iPhone X / XS/XS MAX baseband, and glue removal.
Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183° three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.
Size: 185*54*29mm (Main Unit) , 160*88*48mm (Thermostat)
1 x Main Unit
1 x Thermostat
1 x Power Cable