MJ Z16 BGA Reballing Jig Fixture Soldering Platform for iPhone 11 pro / 11 pro MAX logic board, it is used for positioning and reballing iPhone iPhone 11 pro / 11 pro MAX logic board BGA parts, more convenient and faster for reballing BGA without any damage, the iPhone 11 pro max reballing soldering platform will offer you best solution for iPhone PCB layer dissembling / assembling / Separating repair test working.
MJ Z16 IPhone 11 pro max BGA Reballing Jig Fixture Soldering Platform
1. Install the iPhone 11 pro / 11 pro MAX logic board on the platform
2. Cover the iPhone 11 pro / 11 pro MAX BGA reballing stencil on logic board
3. Evenly spread tin on the cover of the reballing stencil
4. Remove the reballing stencil cover
5. Take out the motherboard and cooperate with the hot air gun to solidify the tin point.