Remove the iphone motherboard BGA chip tool, Remove iphone A8 A9 A10 A11 CPU BGA Ultra thin blade graver tool, Ultra-thin blade 0.05mm graver, capricious good, it can ease between the chip and the board at the end, is not easy to lead off point.
Remove iphone motherboard chip tool burin Remove A8 A9 A10 A11 CPU graver tool, with 10pcs / 27pcs Blade
iphone CPU motherboard repair tools demolition demolition chip artifact artifact
Option 1: 10-IN-1 iphone CPU Removal Graver: 10pcs Blade + 1pcs handle
Option 2: 27-IN-1 iphone CPU Removal Graver: 27pcs Blade + 1pcs handle
Features: Ultra-thin blade, capricious good, it can ease between the chip and the board at the end, is not easy to lead off point.
27-in-1 BGA disassemble blade set is for iPhone A9 A8 A10 A11 Logic Board BGA Chip repair tool kit is used for CPU blade remove chip glue. Specialied iphone repair tool for edge rubber glue blade
1: to clean the knife edge position when the demolition glue chip and chip temperature around 200 Vinyl
2: hot air gun to open 150 degrees, 60 pairs of large air speed for 2 minutes to warm up the motherboard
3: Hot air gun put a small head, a temperature of 350 degrees to open the first blow of the knife position about 10 seconds and then shake inserted into the bottom of the chip.
[Note: When the knife from side to side is not inserted into the well after the time described the tin melting point not melt easily can be inserted to the knife. ]
10pcs/27pcs* Blade (New design)
1pcs * Handle