WDS-700 Optical alignment system BGA rework station for mobile phone motherboard BGA Welding Soldering Repair, WDS-700 Automatic infrared BGA Rework Station for Mobile phone circuit board BGA Welding repair.
Optical alignment system BGA rework station WDS-700
WDS-700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after-sales service and rework.
How to separate BGA chip from motherboard / How to replace a new BGA chip
1: Separate the BGA chip from mother board -we called desoldering
2: Clean Pad
3: Reballing or replace a new BGA chip directly
4: lignment/Positioning -Depend on experience ,silk frame ,optical camera
5: replace a new BGA chip - we called Soldering
user manaul and technical parameters: