WL high-accuracy BGA Reballing Stencil template for iphone 5S 6 6S 7 8 X XS MAX NAND and Baseband Soldering Repair, WL High Quality BGA Reballing Stencils kit come with Black Positioning Mold, WL High-Quality Soldering BGA Reballing Stencil With Fixed Plate.
WL high accuracy BGA Reballing Stencil for iphone 6 7 8 X XS NAND Baseband
Option 1: iphone 5/5s Baseband and NAND
Option 2: iphone 6/6p Baseband and NAND
Option 3: iphone 6s/6sp Baseband and NAND
Option 4: iphone 7/7p Baseband and NAND
Option 5: iphone 8/8p/X Baseband and NAND
Option 6: iphone XS MAX XR Baseband and NAND
With Fixed Plate ( Black Positioning Mold ), Easy to use and more accurate CPU IC welding position.
[ Option Aluminum Mould Base ]: it is universal, can fit with any Black Positioning Mold, (Choose different Package ), and just 1pcs Aluminum Mold Base, easy for your working, and also save money
Option Positioning Mold (Black): Not univeral, can't working with different BGA Reballing Stencil, need the right model BGA Reballing Stencil, the Black Positioning Mold just match with the right BGA Reballing Stencil.